Exclusive Teardown of the Intel Arc Pro B50 Compute Card, Unboxing Intel’s New AI Accelerator
As outlined in Intel’s earlier announcements, the B50 comes with 16 GB of memory, 170 pTOPS, 10.65 TFLOPS of compute power, and a 70 W TDP. The higher-end B60 bumps this up to 24 GB of memory, 197 pTOPS, and a 120–200 W power range. The card we’re unboxing here is the freshly launched Arc Pro B50 GPU—a product built primarily for AI computation and edge server workloads, making it fundamentally different from the gaming GPUs most consumers are familiar with.
The packaging is utilitarian and industrial, shipped in a plain cardboard box with the card sealed inside an anti-static bag.
While the PCIe connector runs the full x16 length, the interface is actually PCIe Gen5 x8. Intel lists the weight at 330 g, and our measurement came in close at 326.5 g.
The plastic shroud bears the “Intel Arc Pro B50” label. Its half-height profile ensures compatibility with server installations. This is a dual-slot card equipped with a blower-style fan, and the subtle blue ring around the fan adds a visual highlight that makes the design feel more refined and futuristic.
On the back, a blue backplate immediately stands out. At first glance it appears to be plastic, but a closer look reveals it’s metal. The backplate is secured with multiple Torx screws, one of them sealed with a tamper-evident sticker. Including two screws on the side, you’ll need to remove 10 screws total to disassemble the shroud.
For display outputs, the card offers four DisplayPort 2.1 connectors, supporting UHBR 13.5 and resolutions up to 8K 7680 × 4320 @ 60 Hz.
Once fully disassembled, the internal design proves straightforward—though it does involve a large number of screws, most requiring a Torx driver.
At the center sits a heatsink fin array bonded to a copper baseplate that makes direct contact with the die. A blower fan channels air through the fins, carrying heat out of the chassis.
The GPU is the Battlemage BMG-G21, fabricated on TSMC’s N5 (5 nm) process. Specs include 16 Xe² Cores, 16 Ray Tracing Units, 128 Intel XMX Engines, and 128 Xe Vector Engines.
The substrate is labeled X520M019 SRWFT 03923. Interestingly, the die isn’t perfectly centered—it sits slightly left on the substrate, but relative to the cooler assembly, it is aligned in the middle. The device ID is 0xE212. Codec support includes H.264, H.265, and AV1, with VP9 decode and bitstream support.
Memory modules are Samsung K4ZAF325BC-SC20 GDDR6, each 16 Gb (2 GB). With four chips per side (eight total), the card provides 16 GB of GDDR6. Samsung rates these modules at 20 Gbps, packaged in 180 FBGA. Intel’s spec sheet, however, lists them at 14 Gbps, giving a total bandwidth of 224 Gbps.
On the back, four additional memory chips are pressed against the blue backplate via thermal pads, aiding heat dissipation. The entire card consumes 70 W, powered solely through the PCIe slot—no external power connector is required.
背面也有四顆記憶體顆粒，四顆都有導熱貼片與藍色的背板貼合，幫助散熱。整張卡功耗 70W，透過 PCIe 供電即可，不需要額外連接電源線。
The blower fan connects via a 4-pin header to the motherboard.
It uses a brushless DC motor (model CF4028U12S), rated 12 V, 0.6 A.
Intel has priced the Arc Pro B50 at USD $349, backed by a three-year warranty. Hands-on testing time has been limited so far, so we’re not yet ready to report on real-world performance. If the results hold up, we’ll be sharing deeper insights in the near future.
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